Application Specific & Reference Design Kits

PIEZO HAPTIC DRIVER, EVALUATION MODULE; Silicon Manufacturer:Texas Instruments; Silicon Core Number:DRV8662; Kit Application Type:Drivers; Application Sub Type:Piezo Haptic Driver; Core Architecture:-; Core Sub-Architecture:-; RoHS Compliant: Yes

LM5050MK-1EVAL/NOPB EVALUATION MODULE; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LM5050-1; Kit Application Type:Power Management; Application Sub Type:OR-ing Controller; Core Architecture:-; Core Sub-Architecture:-;RoHS Compliant: Yes

USB HUB CONTROLLER, EVALUATION MODULE; Silicon Manufacturer:Texas Instruments; Silicon Core Number:TPS2071; Kit Application Type:Power Management; Application Sub Type:USB Hub Controller; Core Architecture:-; Core Sub-Architecture:-;RoHS Compliant: Yes

EVALUATION BOARD, POWER MANAGEMENT; Silicon Manufacturer:Texas Instruments; Silicon Core Number:TPS3700; Kit Application Type:Power Management; Application Sub Type:Window Comparator; Core Architecture:-; Core Sub-Architecture:-; RoHS Compliant: Yes

Silicon Manufacturer:Linear Technology; Silicon Core Number:LTC3880, LTC2974, LTC2977; Kit Application Type:Power Management; Application Sub Type:Power Supply Controller; Core Architecture:-; Core Sub-Architecture:-; Product Range:-RoHS Compliant: NA

DEV BOARD, COMMUNICATION PROCESSOR; Silicon Manufacturer:NXP; Silicon Core Number:LS1021A; Kit Application Type:Evaluation; Application Sub Type:Communication Processor; Core Architecture:ARM; Core Sub-Architecture:Cortex-A7 RoHS Compliant: Yes

DEV BOARD, S12VR STARTERTRAK MOTOR CONTROL; Silicon Manufacturer:NXP; Silicon Core Number:S12VR64; Kit Application Type:Power Management - Motor Control; Application Sub Type:Motor Driver; Core Architecture:S12; Product Range:- RoHS Compliant: Yes

DEV BOARD, WIRELESS CHARGING TX; Silicon Manufacturer:NXP; Silicon Core Number:MWCT1012; Kit Application Type:Power Management; Application Sub Type:Wireless Charger; Core Architecture:-; Core Sub-Architecture:-; Product Range:- RoHS Compliant: Yes

DEV BOARD, WIRELESS CHARGING RX; Silicon Manufacturer:NXP; Silicon Core Number:MWPR1516; Kit Application Type:Power Management; Application Sub Type:Wireless Charger; Core Architecture:-; Core Sub-Architecture:-; Product Range:- RoHS Compliant: Yes

Pure Thermal 1 With Shuttered Lepton Module; Silicon Manufacturer:STMicroelectronics; Silicon Core Number:-; Kit Application Type:-; Application Sub Type:-; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:- RoHS Compliant: Yes

BLUECOIN STARTER KIT, INTERNET OF THINGS; Silicon Manufacturer:STMicroelectronics; Silicon Core Number:STM32F446, BlueNRG-MS; Kit Application Type:Wireless Connectivity; Application Sub Type:Internet of Things (IoT); Core RoHS Compliant: Yes

REF DESIGN BOARD, TOXIC GAS SENSOR ROHS COMPLIANT: YES

CONNECTIVITY KIT, KINTEX-7 FPGA; Silicon Manufacturer:Xilinx; Silicon Core Number:XC7K325T-2FFG900C ; Kit Application Type:Embedded Connectivity; Application Sub Type:-; Core Architecture:FPGA; Core Sub-Architecture:- RoHS Compliant: Yes

EMBEDDED KIT, KINTEX-7 FPGA; Silicon Manufacturer:Xilinx; Silicon Core Number:XC7K325T-2FFG900C; Kit Application Type:Embedded Systems; Application Sub Type:-; Core Architecture:FPGA; Core Sub-Architecture:-; Product Range:- RoHS Compliant: Yes

REF DESIGN BOARD, P1020, PCI EXPRESS, ETHERNET; Silicon Manufacturer:NXP; Silicon Core Number:-; Kit Application Type:Communication & Networking; Application Sub Type:Communication Processor; Core Architecture:-; Kit Contents:Board RoHS Compliant: Yes

EVAL BOARD, 7 MEMS MICROPHONES W/PDM; Silicon Manufacturer:XMOS; Silicon Core Number:XUF216-512-TQ128; Kit Application Type:Microphone Aggregation & Array Microphones; Application Sub Type:Embedded; Core Architecture:xCORE; Core RoHS Compliant: Yes

Silicon Manufacturer:-; Silicon Core Number:-; Kit Application Type:Wireless Connectivity; Application Sub Type:Tower System Wi-Fi Module; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:-; Product Range:- RoHS Compliant: Yes

Silicon Manufacturer:Atmel; Silicon Core Number:-; Kit Application Type:Sensor; Application Sub Type:Bluetooth; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:-; Product Range:- RoHS Compliant: Yes

Silicon Manufacturer:Espressif; Silicon Core Number:-; Kit Application Type:Wireless Connectivity; Application Sub Type:Tower System Wi-Fi Module; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:ESP8266 RoHS Compliant: Yes

EVAL KIT, DEEPCOVER SECURE MCU; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX32520; Kit Application Type:Security; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4F; Silicon Family Name:- RoHS Compliant: Yes