Status: | Active |
---|---|
Series: | MEC1609 |
RoHS: | Compliant |
The MEC1609/MEC1609i is the mixed signal base component of a multi-device advanced I/O controller architecture.
It incorporates a high-performance 32-bit embedded microcontroller with a 192 Kilobyte embedded Flash subsystem, 16 Kilobytes of SRAM and 2 Kilobytes of instruction cache with an Advanced High-performance Bus (AHB), memory-mapped Serial Peripheral Interface (SPI) Flash Read Controller. MEC1609 communicates with the system host using the Intel® Low Pin Count bus. It is directly powered by two individual suspend supply planes (VBAT and VTR) and senses a third runtime power plane (VCC) to provide “instant on” and system power management functions.
Family parts
MEC1609I-PZP
MEC1609I-PZV
MEC1609-PZP
MEC1609-PZV
ARC-625D system controller |
144 LFBGA package |
192KB Embedded Flash Subsystem |
16KB RAM (65B CMOS) |
18x8 keyboard scan matrix |
115 GPIO Pins |
8 SMBus ports |
16 analog to digital converter channels |
3 LED |
3 low-power timers |
8 PWM |
4 Fan Tachometer Inputs |
MCU Serial Debug Port |
Two pin serial debug port with 16C550A register interface |
JTAG interface |
Keyboard Scan Matrix | 18x8 |
---|---|
UART | Y |
Host Interface | LPC |
Crypto Engine | No |
Code Storage | Embedded Flash |
Operating Temperature | -40° C to +85° C |
Low Power Timers | 3 |
Tach | 0 |
Fan Tachometer Inputs | 4 |
Max Operating Frequency | 20 Mhz |
PCI Resets | 0 |
Data RAM | 16KB RAM (65B CMOS) |
HW Auto Fan Controller | 0 |
Breathing/ Blinking LED | 3 |
GPIO | 115 |
PWM | 8 |
Package | 144 LFBGA |
VBAT-Powered, Power Control Interface | Y |
LED | 3 |
Analog to Digital Converter | 16 ch |
Capture/_Compare | 0 |
Temp Monitoring | 0 |
SMBus Ports | 8 |
BC Link | 4 |
SPI_Host | 2 |
Flash/Code RAM | 192KB Flash |
EEPROM | 0 |
PECI | 3 |
System Controller | 32-bit |
ACPI Interfaces | 4 |
Counter/Timers | 4 |
Pins | Packaging | 144 | LFBGA |
Temp Range | -40C to +85C |
Packing Media | Tray (240) |
Application Notes |
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AN 26.14 - ARC Metaware Development System |
Board Design Files |
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MEC1609 IBIS Model |
MEC1609 IBIS Model TFBGA Package (144 Ball) |
JEDEC Indicator | e8 |
---|---|
ROHS | Compliant |
China EFUP | Compliant |
Device Weight (g) | 0.355 |
Shipping Weight (kg) | 1.125 |
Lead Count | 144 |
Package Type | LFBGA |
Package Width or Size | 10x10x1.4 |
Soldering Composition | SAC |
Mixed Signal Mobile Embedded Controller With Flash And Arc Core 144 Lfbga 10X10X1.4 Tray Rohs Compliant: Yes |Microchip MEC1609I-PZP | Newark Electronics |
MIXED SIGNAL MOBILE EMBEDDED CONTROLLER WITH FLASH AND ARC CORE | Avnet America |
Mixed Signal Mobile Embedded Flash ARC EC BC-LinkTM/VLPCTM Base Component | Microchip Technology |
Where can I find additional details, specifications and documents for a MEC1609I-PZP?
Additional datasheets, footprints and schematics for MEC1609I-PZP are listed on our Part Details page. You can also find images and similar parts to MEC1609I-PZP on this page.
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What category does MEC1609I-PZP fall under?
The MEC1609I-PZP is listed under Semiconductors - ICs > More Semiconductors - ICs.
Can I view similar or alternative parts?
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Is the MEC1609I-PZP RoHS compliant?
Yes. This part has been flagged as RoHS Compliant by Microchip Technology.
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Authorised distributors including Newark Electronics, Avnet America and Microchip Technology have stock available or on a lead time for MEC1609I-PZP.
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