MEC1609I-PZP More Semiconductors - ICs by Microchip Technology

Embedded Controller

Status: Active
Series: MEC1609
RoHS: Compliant
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The MEC1609/MEC1609i is the mixed signal base component of a multi-device advanced I/O controller architecture.

It incorporates a high-performance 32-bit embedded microcontroller with a 192 Kilobyte embedded Flash subsystem, 16 Kilobytes of SRAM and 2 Kilobytes of instruction cache with an Advanced High-performance Bus (AHB), memory-mapped Serial Peripheral Interface (SPI) Flash Read Controller. MEC1609 communicates with the system host using the Intel® Low Pin Count bus. It is directly powered by two individual suspend supply planes (VBAT and VTR) and senses a third runtime power plane (VCC) to provide “instant on” and system power management functions.

Family parts
MEC1609I-PZP
MEC1609I-PZV
MEC1609-PZP
MEC1609-PZV

Where to Buy

Prices starting from US$6.71

Distributor Stock
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Newark
from US$7.26
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Avnet America
from US$9.27
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Microchip Technology
from US$6.71
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Features

ARC-625D system controller
144 LFBGA package
192KB Embedded Flash Subsystem
16KB RAM (65B CMOS)
18x8 keyboard scan matrix
115 GPIO Pins
8 SMBus ports
16 analog to digital converter channels
3 LED
3 low-power timers
8 PWM
4 Fan Tachometer Inputs
MCU Serial Debug Port
Two pin serial debug port with 16C550A register interface
JTAG interface

Specifications

Keyboard Scan Matrix 18x8
UART Y
Host Interface LPC
Crypto Engine No
Code Storage Embedded Flash
Operating Temperature -40° C to +85° C
Low Power Timers 3
Tach 0
Fan Tachometer Inputs 4
Max Operating Frequency 20 Mhz
PCI Resets 0
Data RAM 16KB RAM (65B CMOS)
HW Auto Fan Controller 0
Breathing/ Blinking LED 3
GPIO 115
PWM 8
Package 144 LFBGA
VBAT-Powered, Power Control Interface Y
LED 3
Analog to Digital Converter 16 ch
Capture/_Compare 0
Temp Monitoring 0
SMBus Ports 8
BC Link 4
SPI_Host 2
Flash/Code RAM 192KB Flash
EEPROM 0
PECI 3
System Controller 32-bit
ACPI Interfaces 4
Counter/Timers 4
Pins | Packaging 144 | LFBGA
Temp Range -40C to +85C
Packing Media Tray (240)

Environmental Information

JEDEC Indicator e8
ROHS Compliant
China EFUP Compliant
Device Weight (g) 0.355
Shipping Weight (kg) 1.125
Lead Count 144
Package Type LFBGA
Package Width or Size 10x10x1.4
Soldering Composition SAC

Alternative Descriptions

Mixed Signal Mobile Embedded Controller With Flash And Arc Core 144 Lfbga 10X10X1.4 Tray Rohs Compliant: Yes |Microchip MEC1609I-PZP | Newark Electronics
MIXED SIGNAL MOBILE EMBEDDED CONTROLLER WITH FLASH AND ARC CORE | Avnet America
Mixed Signal Mobile Embedded Flash ARC EC BC-LinkTM/VLPCTM Base Component | Microchip Technology


Frequently Asked Questions

Where can I find additional details, specifications and documents for a MEC1609I-PZP?

Additional datasheets, footprints and schematics for MEC1609I-PZP are listed on our Part Details page. You can also find images and similar parts to MEC1609I-PZP on this page.

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What category does MEC1609I-PZP fall under?

The MEC1609I-PZP is listed under Semiconductors - ICs > More Semiconductors - ICs.

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Is the MEC1609I-PZP RoHS compliant?

Yes. This part has been flagged as RoHS Compliant by Microchip Technology.

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Authorised distributors including Newark Electronics, Avnet America and Microchip Technology have stock available or on a lead time for MEC1609I-PZP.

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