Memory
Memory, specifically semiconductor memory, is used for storing instruction and data. It is an important component in electronics for computer-based printed circuit board (PCB) assemblies. Basically, it functions like the brain – it takes in data, processes this, and then stores the information for later use.
A memory chip has memory cells, and these cells have one or more transistors. The chip has address pins where memory address is applied. This type of address is a binary number that is essential for ensuring the accessibility of data.
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In the 1960s, the earliest form of semiconductor memory using bipolar transistors was introduced. In 1961, Texas Instruments provided the U.S. Air Force with bipolar semiconductor memory created using discrete devices. Fairchild Semiconductor’s Bob Norman then introduced solid-state memory for integrated circuits, but it wasn’t until 1965 when IBM came out with the SP95, the first bipolar semiconductor integrated circuit chip.
At present, semiconductor memory comes in different forms. There are:
- Integrated circuits for printed board assemblies
- Compact flash cards
- Solid-state hard drives
- USB memory cards
- SD memory cards
Semiconductor memory can be integrated as onboard memory for microprocessor chips.
Memory devices are used for numerous applications, including:
- Hard disk drives
- Printers
- Desktop computers
- Main computer memory
- Graphics cards
- Mobile phones
- Printers
- Modems
- Anti-lock braking systems (ABS)
- Flight controllers
- Digital cameras
- Tablets
- Medical equipment
Types
There are two main types of memory according to how it operates: RAM and ROM.
- RAM, which stands for “random access memory”, refers to semiconductor memory that is volatile, so it needs power to retain data. It is also readable and writable. DRAM (dynamic random access memory), SRAM (static random access memory), and CAM (content-addressable memory) are all RAM memory devices.
- ROM is read-only memory. It is non-volatile, so data is retained even without power. It stores permanent data but the device cannot be written to, only read from. Examples of ROM are EPROM (erasable programmable ROM), MROM (mask programmed ROM), PROM (programmable read-only memory), and EEPROM (electrically erasable programmable ROM).
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SDRAM, DDR3, 2GB (X16), 96FBGA; Memory Type:DRAM - Synchronous; DRAM Memory Configuration:128M x 16bit; Access Time:-; Page Size:2048Byte; Memory Case Style:FBGA; No. of Pins:96; IC Interface Type:-; Operating Temperature Min:0°C; RoHS Compliant: Yes
SDRAM, DDR3, 4GB (X16), 96FBGA; Memory Type:DRAM - Synchronous; DRAM Memory Configuration:256M x 16bit; Access Time:-; Page Size:2048Byte; Memory Case Style:FBGA; No. of Pins:96; IC Interface Type:-; Operating Temperature Min:0°C; RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Type:DDR3; DRAM Density:4Gbit; DRAM Memory Configuration:256M x 16bit; Clock Frequency:800MHz; Memory Case Style:BGA; No. of Pins:96Pins; Supply Voltage Nom:1.5V; Access Time:-; MSL:- RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Type:DDR3; DRAM Density:4Gbit; DRAM Memory Configuration:256M x 16bit; Clock Frequency:800MHz; Memory Case Style:BGA; No. of Pins:96Pins; Supply Voltage Nom:1.5V; Access Time:-; MSL:MSL 3 - 168 hours RoHS Compliant: Yes
DRAM, 64M X 16BIT, FBGA-96; DRAM Type:DDR3; DRAM Density:1Gbit; DRAM Memory Configuration:64M x 16bit; Clock Frequency:800MHz; Memory Case Style:FBGA; No. of Pins:96Pins; Supply Voltage Nom:1.5V; Access Time:-; MSL:- RoHS Compliant: Yes
SDRAM, IND, 4M X 16, 3V, 54TSOP2; DRAM Memory Configuration:4 BLK (1M x 16); Access Time:5.4ns; Page Size:64Mbit; No. of Pins:54Pins; Memory Case Style:TSOP-II; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; IC RoHS Compliant: Yes
DRAM, 16MBIT, TSOP-II-44; DRAM Type:EDO; DRAM Density:16Mbit; DRAM Memory Configuration:1M x 16bit; Clock Frequency:-; Memory Case Style:TSOP-II; No. of Pins:44Pins; Supply Voltage Nom:3.3V; Access Time:50ns; MSL:- RoHS Compliant: Yes
DRAM, 16MBIT, TSOP-II-44; DRAM Type:FP; DRAM Density:16Mbit; DRAM Memory Configuration:1M x 16bit; Clock Frequency:-; Memory Case Style:TSOP-II; No. of Pins:44Pins; Supply Voltage Nom:3.3V; Access Time:50ns; MSL:- RoHS Compliant: Yes
DRAM, 64M X 16BIT, WBGA-84; DRAM Memory Configuration:64M x 16bit; Memory Case Style:WBGA; No. of Pins:84Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product RoHS Compliant: Yes
DRAM, 128M X 16BIT, BGA-96; DRAM Memory Configuration:128M x 16bit; Memory Case Style:BGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:0°C; Operating Temperature Max:95°C; Product RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Memory Configuration:256M x 16bit; Memory Case Style:BGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:0°C; Operating Temperature Max:95°C; Product RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Memory Configuration:256M x 16bit; Memory Case Style:BGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature Max:95°C; Product RoHS Compliant: Yes
SDRAM, 256MBIT, 143MHZ, TSOP-54; DRAM Type:SDR; DRAM Density:256Mbit; DRAM Memory Configuration:4 BLK (4M x 16); Clock Frequency:143MHz; Memory Case Style:TSOP; No. of Pins:54Pins; Supply Voltage Nom:3.3V; Access Time:7ns; MSL:- RoHS Compliant: Yes
SDRAM, 64MBIT, 143MHZ, TSOP-54; DRAM Type:SDRAM; DRAM Density:64Mbit; DRAM Memory Configuration:1M x 16bit; Clock Frequency:143MHz; Memory Case Style:TSOP; No. of Pins:54Pins; Supply Voltage Nom:3.3V; Access Time:7ns; MSL:- RoHS Compliant: Yes
SDRAM, 128MBIT, 143MHZ, TSOP-54; DRAM Type:SDR; DRAM Density:128Mbit; DRAM Memory Configuration:16M x 8bit; Clock Frequency:143MHz; Memory Case Style:TSOP; No. of Pins:54Pins; Supply Voltage Nom:3.3V; Access Time:7ns RoHS Compliant: Yes
SDRAM, 256MBIT, 143MHZ, BGA-90; DRAM Type:SDR; DRAM Density:256Mbit; DRAM Memory Configuration:4 BLK (2M x 32); Clock Frequency:143MHz; Memory Case Style:BGA; No. of Pins:90Pins; Supply Voltage Nom:3.3V; Access Time:7ns RoHS Compliant: Yes
SDRAM, 512MBIT, 143MHZ, BGA-54; DRAM Memory Configuration:32M x 16bit; Memory Case Style:BGA; No. of Pins:54Pins; IC Interface Type:LVTTL; Access Time:7ns; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature Max:85°C;RoHS Compliant: Yes
SDRAM, 256MBIT, 133MHZ, BGA-54; DRAM Memory Configuration:16M x 16bit; Memory Case Style:BGA; No. of Pins:54Pins; IC Interface Type:LVCMOS; Access Time:7.5ns; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature RoHS Compliant: Yes
SDRAM, DDR3, 4GB, 1333MT/S, FBGA-96; DRAM Memory Configuration:256M x 16bit; Memory Case Style:FBGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:13.5ns; Page Size:16Kbit; Operating Temperature Min:-40°C; Operating RoHS Compliant: Yes