DRAM
DRAM stands for “dynamic random access memory”. It is a type of random access memory (RAM) and is considered the most commonly used and available computer memory. It is read as DEE-RAM.
Invented by Robert Dennard in 1968, DRAM was first introduced into the market by Intel. It is positioned near the processor, which means it can be quickly accessed when the computer needs it for various processes.
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DRAM both has a capacitor and transistor. It is a volatile memory, so it needs power to keep data. It can be altered as well, as stored data does not have to be deleted before it is overwritten.
This small, efficient, and fast-working memory is labeled as dynamic because of its slow capacitor discharge. It is also a random access memory because the same time frame is used to reach any memory address. DRAM is best suited for high-storage and high-capacity memory devices. DRAM is used for a variety of applications and products, including:
- Digital cameras
- Video cards
- Portable media players and other consumer electronics
- Automotive electronics
- Smartphones
- Desktop and laptop computers
- GPS
- Other personal and mobile devices
Types
Dynamic random access memory is categorized into six types: FPM, Asynchronous, BEDO, EDO, RDRAM, and SDRAM.
- FPM, also known as Fast Page Mode Dynamic Random Access Memory, is distinct because it runs faster than other DRAM types.
- Asynchronous DRAM is one of the older types of dynamic random access memory. It was used in the earlier models of personal computers. It is not synchronized with the computer’s system clock. Asynchronous DRAM is the basis for other DRAM types.
- BEDO (Burst Extended Data Out) DRAM maximizes performance through one burst, which is capable of processing four memory addressed all at once.
- EDO (Extended Data Out) DRAM increases performance over Fast Page Mode DRAM, which is why it is alternatively called Hyper Page Model.
- RDRAM is Rambus DRAM, which was created for Rambus Inc. It is capable of functioning at faster speeds.
- SDRAM (Synchronous DRAM) is synchronized with the computer’s clock, so it is faster than the other types of DRAM and RAM.
Parts from DRAM Category
SDRAM, DDR3, 2GB (X16), 96FBGA; Memory Type:DRAM - Synchronous; DRAM Memory Configuration:128M x 16bit; Access Time:-; Page Size:2048Byte; Memory Case Style:FBGA; No. of Pins:96; IC Interface Type:-; Operating Temperature Min:0°C; RoHS Compliant: Yes
SDRAM, DDR3, 4GB (X16), 96FBGA; Memory Type:DRAM - Synchronous; DRAM Memory Configuration:256M x 16bit; Access Time:-; Page Size:2048Byte; Memory Case Style:FBGA; No. of Pins:96; IC Interface Type:-; Operating Temperature Min:0°C; RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Type:DDR3; DRAM Density:4Gbit; DRAM Memory Configuration:256M x 16bit; Clock Frequency:800MHz; Memory Case Style:BGA; No. of Pins:96Pins; Supply Voltage Nom:1.5V; Access Time:-; MSL:- RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Type:DDR3; DRAM Density:4Gbit; DRAM Memory Configuration:256M x 16bit; Clock Frequency:800MHz; Memory Case Style:BGA; No. of Pins:96Pins; Supply Voltage Nom:1.5V; Access Time:-; MSL:MSL 3 - 168 hours RoHS Compliant: Yes
DRAM, 64M X 16BIT, FBGA-96; DRAM Type:DDR3; DRAM Density:1Gbit; DRAM Memory Configuration:64M x 16bit; Clock Frequency:800MHz; Memory Case Style:FBGA; No. of Pins:96Pins; Supply Voltage Nom:1.5V; Access Time:-; MSL:- RoHS Compliant: Yes
SDRAM, IND, 4M X 16, 3V, 54TSOP2; DRAM Memory Configuration:4 BLK (1M x 16); Access Time:5.4ns; Page Size:64Mbit; No. of Pins:54Pins; Memory Case Style:TSOP-II; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; IC RoHS Compliant: Yes
DRAM, 16MBIT, TSOP-II-44; DRAM Type:EDO; DRAM Density:16Mbit; DRAM Memory Configuration:1M x 16bit; Clock Frequency:-; Memory Case Style:TSOP-II; No. of Pins:44Pins; Supply Voltage Nom:3.3V; Access Time:50ns; MSL:- RoHS Compliant: Yes
DRAM, 16MBIT, TSOP-II-44; DRAM Type:FP; DRAM Density:16Mbit; DRAM Memory Configuration:1M x 16bit; Clock Frequency:-; Memory Case Style:TSOP-II; No. of Pins:44Pins; Supply Voltage Nom:3.3V; Access Time:50ns; MSL:- RoHS Compliant: Yes
DRAM, 64M X 16BIT, WBGA-84; DRAM Memory Configuration:64M x 16bit; Memory Case Style:WBGA; No. of Pins:84Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product RoHS Compliant: Yes
DRAM, 128M X 16BIT, BGA-96; DRAM Memory Configuration:128M x 16bit; Memory Case Style:BGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:0°C; Operating Temperature Max:95°C; Product RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Memory Configuration:256M x 16bit; Memory Case Style:BGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:0°C; Operating Temperature Max:95°C; Product RoHS Compliant: Yes
DRAM, 256M X 16BIT, BGA-96; DRAM Memory Configuration:256M x 16bit; Memory Case Style:BGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:-; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature Max:95°C; Product RoHS Compliant: Yes
SDRAM, 256MBIT, 143MHZ, TSOP-54; DRAM Type:SDR; DRAM Density:256Mbit; DRAM Memory Configuration:4 BLK (4M x 16); Clock Frequency:143MHz; Memory Case Style:TSOP; No. of Pins:54Pins; Supply Voltage Nom:3.3V; Access Time:7ns; MSL:- RoHS Compliant: Yes
SDRAM, 64MBIT, 143MHZ, TSOP-54; DRAM Type:SDRAM; DRAM Density:64Mbit; DRAM Memory Configuration:1M x 16bit; Clock Frequency:143MHz; Memory Case Style:TSOP; No. of Pins:54Pins; Supply Voltage Nom:3.3V; Access Time:7ns; MSL:- RoHS Compliant: Yes
SDRAM, 128MBIT, 143MHZ, TSOP-54; DRAM Type:SDR; DRAM Density:128Mbit; DRAM Memory Configuration:16M x 8bit; Clock Frequency:143MHz; Memory Case Style:TSOP; No. of Pins:54Pins; Supply Voltage Nom:3.3V; Access Time:7ns RoHS Compliant: Yes
SDRAM, 256MBIT, 143MHZ, BGA-90; DRAM Type:SDR; DRAM Density:256Mbit; DRAM Memory Configuration:4 BLK (2M x 32); Clock Frequency:143MHz; Memory Case Style:BGA; No. of Pins:90Pins; Supply Voltage Nom:3.3V; Access Time:7ns RoHS Compliant: Yes
SDRAM, 512MBIT, 143MHZ, BGA-54; DRAM Memory Configuration:32M x 16bit; Memory Case Style:BGA; No. of Pins:54Pins; IC Interface Type:LVTTL; Access Time:7ns; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature Max:85°C;RoHS Compliant: Yes
SDRAM, 256MBIT, 133MHZ, BGA-54; DRAM Memory Configuration:16M x 16bit; Memory Case Style:BGA; No. of Pins:54Pins; IC Interface Type:LVCMOS; Access Time:7.5ns; Page Size:-; Operating Temperature Min:-40°C; Operating Temperature RoHS Compliant: Yes
SDRAM, DDR3, 4GB, 1333MT/S, FBGA-96; DRAM Memory Configuration:256M x 16bit; Memory Case Style:FBGA; No. of Pins:96Pins; IC Interface Type:-; Access Time:13.5ns; Page Size:16Kbit; Operating Temperature Min:-40°C; Operating RoHS Compliant: Yes