Development Boards, Evaluation Tools

TINKERKIT BRACCIO ARDUINO ROBOTIC ARM; Silicon Manufacturer:-; Silicon Core Number:-; Kit Application Type:Robotic; Application Sub Type:-; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:-; Product Range:- RoHS Compliant: Yes

EVALUATION BOARD, 7W ISOLATED FLYBACK REGULATOR; Silicon Manufacturer:Linear Technology; Silicon Core Number:LT3573; Kit Application Type:Power Management; Application Sub Type:Flyback Regulators; Core Architecture:-

EVALUATION BOARD, 10W ISOLATED FLYBACK REGULATOR; Silicon Manufacturer:Linear Technology; Silicon Core Number:LT3575; Kit Application Type:Power Management; Application Sub Type:Flyback Regulators; Core Architecture:-

T1235H, UNIV MOTOR CONTROL, DEMO BOARD; Silicon Manufacturer:STMicroelectronics; Silicon Core Number:STM8S103F2; Kit Application Type:Power Management - Motor Control; Application Sub Type:Motor Driver; Core Architecture:STM8 RoHS Compliant: Yes

REF DESIGN BOARD, THERMAL PRINTER; Silicon Manufacturer:STMicroelectronics; Silicon Core Number:IPC002V1; Kit Application Type:Thermal Printer; Application Sub Type:-; Core Architecture:ARM; Core Sub-Architecture:Cortex-M3 RoHS Compliant: Yes

ARC WELDER, 2.5KW, INDUSTRIAL, DEMO BOARD; Silicon Manufacturer:STMicroelectronics; Silicon Core Number:STGW35HF60WD; Kit Application Type:Power Management; Application Sub Type:Arc Welding System; Core Architecture:-

DEV BOARD, DSPIC MCHV-2 MOTOR CONTROL; Silicon Manufacturer:Microchip; Silicon Core Number:dsPIC33EP256MC506; Kit Application Type:Power Management - Motor Control; Application Sub Type:AC Induction or Brushless Motor RoHS Compliant: NA

Silicon Manufacturer:Microchip; Silicon Core Number:-; Kit Application Type:Wireless Connectivity; Application Sub Type:WiFi; Core Architecture:-; Core Sub-Architecture:-; Silicon Family Name:-; Product Range:- RoHS Compliant: NA

EVAL BOARD, FREQ TRANSLATOR, 40MHZ; Silicon Manufacturer:Abracon Corporation; Silicon Core Number:ABFT-40.000MHZ; Kit Application Type:Clock & Timing; Application Sub Type:Frequency Translator; Core Architecture:-; Core RoHS Compliant: Yes

DEV BOARD, PIC32 MCU WITH PCAP; Silicon Manufacturer:Microchip; Silicon Core Number:PIC32MX795F512L; Kit Application Type:Sensing - Touch, Proximity; Application Sub Type:Capacitive Touch; Core Architecture:PIC; Product Range:- RoHS Compliant: Yes

DEV BOARD, PROTOTYPING PLATFORM; Silicon Manufacturer:Cypress; Silicon Core Number:CY8C4147Z1-S475; Kit Application Type:Embedded; Application Sub Type:Prototyping; Core Architecture:ARM; Core Sub-Architecture:Cortex-M0+; Silicon RoHS Compliant: Yes

MOD REF BOARD, RF TRANSCEIVER; Silicon Manufacturer:NXP; Silicon Core Number:MKW01; Kit Application Type:Wireless Development; Application Sub Type:RF Transceiver; Core Architecture:ARM; Core Sub-Architecture:Cortex-M0; Silicon RoHS Compliant: Yes

REF DESIGN BOARD, MKL25Z128VFM4 MCU; Silicon Manufacturer:NXP; Silicon Core Number:MK20DX128VFM5, MKL25Z128VFM4; Kit Application Type:Sensor Signal Conditioner; Application Sub Type:Data Logger; Core Architecture:ARM; Core RoHS Compliant: Yes

EVAL BOARD, RAPID DEVELOPMENT PLATFORM; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX32620/MAX77650/MAX17055; Kit Application Type:Embedded; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4 RoHS Compliant: Yes

REFERENCE DESIGN BOARD, BLDC MOTOR; Silicon Manufacturer:Silicon Laboratories; Silicon Core Number:C8051F850; Kit Application Type:Power Management - Motor Control; Application Sub Type:BLDC Motor; Core Architecture:8051; Core RoHS Compliant: Yes

DEMO/DEV KIT, BLUETOOTH LOW ENERGY; Silicon Manufacturer:Nordic Semiconductor; Silicon Core Number:NRF51822; Kit Application Type:RF / IF; Application Sub Type:Bluetooth Low Energy; Core Architecture:-; Core Sub-Architecture:-; RoHS Compliant: Yes

APPLICATION KIT, TRICORE TFT DISPLAY ROHS COMPLIANT: YES

DEV MODULE, USB-MULTI-INTERFACE BRIDGING; Silicon Manufacturer:Bridgetek; Silicon Core Number:FT932; Kit Application Type:Embedded; Application Sub Type:USB to Multi-interface Bridging; Core Architecture:-; Core Sub-Architecture:-; RoHS Compliant: Yes

DEV BOARD, BLUETOOTH LOW ENERGY; Silicon Manufacturer:Microchip; Silicon Core Number:ATmega3208, RN4870 Module; Kit Application Type:Wireless Communication; Application Sub Type:Bluetooth Low Energy; Core Architecture:AVR

DEV BOARD, BLUETOOTH LOW ENERGY; Silicon Manufacturer:Microchip; Silicon Core Number:PIC16LF18456, RN4870 Module; Kit Application Type:Wireless Communication; Application Sub Type:Bluetooth Low Energy; Core Architecture:PIC