Status: | Active |
---|---|
Series: | ATSAMS70Q20 |
RoHS: | Compliant |
The Microchip SAMS70Q20 devices are members of a flash microcontrollers family based on the high-performance 32-bit ARM Cortex-M7 processor with Floating Point Unit (FPU). These devices operate at up to 300MHz and feature up to 1024 Kbytes of Flash, up to 384 Kbytes of multi-port SRAM and configurable Instruction and Data Tightly Couple Memories to leverage the advanced DSP capabilities of the core. SAMS70Q20 features multiple communication interfaces including a HS USB Host and Device, a HS SDCard/SDIO/MMC interface, USARTs, SPIs and multiple TWIs. Analog features include dual 2Msps 12-bit ADCs with analog front end offering offset and gain error correction, and 2Msps 12-bit DAC.
The SAMS70Q20 is available in 144-pin QFP and BGA package options.
Note: While there are no plans to change the availability status of Revision A for this device, new designs should use Revision B for prototypes and production.Simple- and double-precision HW Floating Point Unit (FPU) |
Memory Protection Unit (MPU) with 16 zones |
DSP Instructions, Thumb®-2 Instruction Set |
Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU) |
Up to 2048 Kbytes embedded Flash with unique identifier and user signature for user-defined data |
Up to 384 Kbytes embedded Multi-port SRAM |
Tightly Coupled Memory (TCM) interface with four configurations (disabled, 2 x 32 Kbytes, 2 x 64 Kbytes, 2 x 128 Kbytes) |
16 Kbytes ROM with embedded Boot Loader routines (UART0, USB) and IAP routines |
16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash with on-the-fly scrambling |
Embedded voltage regulator for single-supply operation |
Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation |
Quartz or ceramic resonator oscillators: 3 to 20 MHz main oscillator with failure detection, 12 MHz or 16 MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock |
RTC with Gregorian calendar mode, waveform generation in low-power modes |
RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations |
32-bit low-power Real-time Timer (RTT) |
High-precision 4/8/12 MHz internal RC oscillator with 4 MHz default frequency for device startup. In-application trimming access for frequency adjustment. 8/12 MHz are factory-trimmed. |
32.768 kHz crystal oscillator or embedded 32 kHz (typical) RC oscillator as source of low-power mode device clock (SLCK) |
One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations |
Temperature Sensor |
One dual-port 24-channel central DMA Controller (XDMAC) |
Low-power Sleep, Wait and Backup modes, with typical power consumption down to 1.1 µA in Backup mode with RTC, RTT and wake-up logic enabled |
Ultra-low-power RTC and RTT |
1 Kbyte of backup RAM (BRAM) with dedicated regulator |
USB 2.0 Device/Mini Host High-speed (USBHS) at 480 Mbps, 4-Kbyte FIFO, up to 10 bidirectional endpoints, dedicated DMA |
12-bit ITU-R BT. 601/656 Image Sensor Interface (ISI) |
Three USARTs. USART0/1/2 support LIN mode, ISO7816, IrDA®, RS-485, SPI, Manchester and Modem modes; USART1 supports LON mode. |
Five 2-wire UARTs with SleepWalking support |
Three Two-Wire Interfaces (TWIHS) (I2 C-compatible) with SleepWalking support |
Quad I/O Serial Peripheral Interface (QSPI) interfacing up to 256 MB Flash and with eXecute-In-Place and onthe-fly scrambling |
Two Serial Peripheral Interfaces (SPI) |
One Serial Synchronous Controller (SSC) with I2S and TDM support |
Two Inter-IC Sound Controllers (I2SC) |
One High-speed Multimedia Card Interface (HSMCI) (SDIO/SD Card/e.MMC) |
Four Three-Channel 16-bit Timer/Counters (TC) with Capture, Waveform, Compare and PWM modes, constant on time. Quadrature decoder logic and 2-bit Gray Up/Down Counter for stepper motor |
Two 4-channel 16-bit PWMs with complementary outputs, Dead Time Generator and eight fault inputs per PWM for motor control, two external triggers to manage power factor correction (PFC), DC-DC and lighting control. |
Two Analog Front-End Controllers (AFEC), each supporting up to 12 channels with differential input mode and programmable gain stage, allowing dual sample-and-hold at up to 2 Msps. Gain and offset error autotest feature. |
One 2-channel 12-bit 1Msps-per-channel Digital-to-Analog Controller (DAC) with differential and oversampling modes |
One Analog Comparator (ACC) with flexible input selection, selectable input hysteresis |
True Random Number Generator (TRNG) |
AES: 256-, 192-, 128-bit Key Algorithm, Compliant with FIPS PUB-197 Specifications ̶ Integrity Check Monitor (ICM). Supports Secure Hash Algorithm SHA1, SHA224 and SHA256. |
Up to 114 I/O lines with external interrupt capability (edge- or level-sensitivity), debouncing, glitch filtering and On-die Series Resistor Termination |
Five Parallel Input/Output Controllers (PIO) |
Part Family | SAMS70 |
---|---|
CPU Type | Cortex-M7 |
MaxSpeed (MHz) | 300 |
Program Memory Size (KB) | 1024 |
SRAM (KB) | 384 |
Data EEPROM (bytes) | 0 |
Temp. Range Min. | -40 |
Temp. Range Max. | 105 |
Operation Voltage Min.(V) | 1.7 |
Operation Voltage Max.(V) | 3.6 |
Direct Memory Access (DMA) Channels | 24 |
SPI | 5 -SPI |
I2C | 3 |
UART | 8 |
QSPI | 1 |
I2S | 3 |
SDIO/SD-CARD/eMMC | 1 |
Ethernet | None |
USB Interface | High Speed |
Number of USB Modules | 1 |
Type of CAN module | None |
Number of CAN Modules | 0 |
Crypto Engine | Yes |
Max ADC Resolution (bits) | 12 |
Max ADC Sampling Rate (ksps) | 1700 |
ADC Channels | 24 |
Max DAC Resolution (bits) | 12 |
DAC outputs | 2 |
Hardware Touch Peripheral | None |
Number of Comparators | 1 |
Motor Control PWM Channels | 16 |
Quadrature Encoder Interface (QEI) | 4 |
Internal Oscillator | 4,8,12Mhz, 32Khz |
Hardware RTCC | Yes |
Max I/O Pins | 114 |
Pin Count | 144 |
Low Power | No |
Pins | Packaging | 144 | LFBGA |
Temp Range | -40C to +105C |
Packing Media | Tape and reel (1000) |
Data Sheets |
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SAM E70/S70/V70/V71 Data Sheet |
Design Checklist |
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Basic 32-Bit MCU Design and Troubleshooting Checklist |
User Guides |
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SAME70-XPLD Xplained User Guide |
JEDEC Indicator | e8 |
---|---|
ROHS | Compliant |
China EFUP | Compliant |
Device Weight (g) | 0.2154 |
Shipping Weight (kg) | 0.217 |
Lead Count | 144 |
Package Type | LFBGA |
Package Width or Size | 10x10x1.4mm |
Soldering Composition | SAC105 |
Cortex-M7, 300 MHZ, 1MB Flash, 384KB SRAM | Microchip Technology |
Mcu, 32Bit, 300Mhz, Lfbga-144 | Newark Electronics |
32-Bit ARM Cortex-M7 Microcontroller RISC 1 Mbyte Flash 384 Kbyte SRAM 1.8V/3.3V 144-Pin LFBGA T/R | Avnet America |
MCU, 32BIT, 300MHZ, LFBGA-144 | Farnell |
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