KEMET’s High Voltage with Flexible Termination (HV FT-CAP) surface mount MLCCs in C0G dielectric address the primary failure mode of MLCCs—flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Featuring several of the highest CV (capacitance/voltage) values available in the industry, these devices utilize a pliable and conductive silver epoxy between the base metal and nickel barrier layers of the termination system. The addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although flexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. KEMET’s high voltage surface mount MLCCs in C0G dielectric feature a 125°C maximum operating temperature and offers the most stable voltage and temperature performance of all ceramic dielectric materials. C0G (NP0) dielectric capacitors exhibit no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30ppm/ºC from -55°C to +125°C.