5645951-2

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Series Information for 5645951-2 - TE Connectivity
  • Status: Active
  • Product Code: 3076
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

SOCKET,MIN-SPR B-N SN-AU SER-2

Specifications

Sealant:
No
Sleeve Plating Material:
Tin
Sleeve Material:
Copper
Contact Mating Area Plating Thickness:
30µm, 30µin
Contact Current Rating (Max):
5A
Contact Base Material:
Beryllium Copper
Contact Spring Plating Material:
Gold
Socket Type:
Discrete
Contact Type:
Socket
Contact Transmits (Typical):
Signal (Data)/Power
Contact Spring Plating Thickness:
30µin, .762µm
Wire Size:
.162 – .326mm², 25 – 22AWG
PCB Thickness (Recommended):
.79 – 3.18mm, .031 – .125in
Hole Size (Recommended):
1.32mm, .052in
Socket Length:
.158in, 4.01mm
Mating Pin Diameter Range:
.51 – .66mm, .02 – .026in
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Method:
Loose Piece, Bag
Packaging Quantity:
2000
Connector System:
Cable-to-Board
Profile:
Zero
Sleeve Style:
Bullet Nose
Connector & Contact Terminates To:
Printed Circuit Board
Wire/Cable Type:
Discrete Wire
Product Type:
Contact
Sealable:
No
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Insertion Method:
Hand/Semi-Automatic/Automatic
Termination Method to Wire & Cable:
Solder
Operating Temperature Range:
-85 – 257°F, -65 – 125°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Pin-in-Paste capable to 260°C

Alternate Descriptions

Avnet America
Conn Discrete Socket SKT 1 POS Solder ST SMD Loose Piece
Avnet Europe
Conn Discrete Socket SKT 1 POS Solder ST SMD Loose Piece