5645947-1

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Series Information for 5645947-1 - TE Connectivity
  • Status: Active
  • Product Code: 3084
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

SOCKET,MIN-SPR B-N SN-SN SER-1

Specifications

Sleeve Plating Material:
Tin
Sealant:
Yes
Sleeve Material:
Copper
Contact Mating Area Plating Thickness:
30µm, 30µin
Contact Current Rating (Max):
5A
Contact Base Material:
Beryllium Copper
Contact Spring Plating Material:
Tin
Socket Type:
Discrete
Contact Type:
Socket
Contact Transmits (Typical):
Signal (Data)/Power
Contact Spring Plating Thickness:
2.54µm, 30µin
Hole Size (Recommended):
.042in, 1.07mm
Socket Length:
.158in, 4.01mm
Wire Size:
27 – 24AWG, .102 – .205mm²
Mating Pin Diameter Range:
.38 – .53mm, .015 – .021in
PCB Thickness (Recommended):
.79 – 3.18mm, .031 – .125in
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Quantity:
50000
Packaging Method:
Reel
Wire/Cable Type:
Discrete Wire
Product Type:
Contact
Connector & Contact Terminates To:
Printed Circuit Board
Sleeve Style:
Bullet Nose
Sealable:
No
Profile:
Zero
Connector System:
Cable-to-Board
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Insertion Method:
Hand/Semi-Automatic
Termination Method to Wire & Cable:
Solder
Operating Temperature Range:
-85 – 257°F, -65 – 125°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Pin-in-Paste capable to 260°C

Alternate Descriptions

Avnet America
SOCKET,MIN-SPR B-N SN-SN SER-1
Avnet Europe
SOCKET,MIN-SPR B-N SN-SN SER-1