5645502-1

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Series Information for 5645502-1 - TE Connectivity
  • Status: Active
  • Product Code: 3084
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

SKT MS S4 BN SN-AU 50M

Specifications

Sleeve Plating Material:
Tin
Sealant:
No
Sleeve Material:
Copper
Contact Spring Plating Material:
Gold
Contact Mating Area Plating Thickness:
30µm, 30µin
Contact Spring Plating Thickness:
30µin
Socket Type:
Discrete
Contact Transmits (Typical):
Signal (Data)/Power
Contact Type:
Socket
Contact Base Material:
Beryllium Copper
Contact Current Rating (Max):
7.5A
Socket Length:
.26in, 6.6mm
PCB Thickness (Recommended):
.031 – .125in, .79 – 3.18mm
Wire Size:
.653mm², 19AWG
Hole Size (Recommended):
.069in, 1.75mm
Mating Pin Diameter Range:
.94 – 1.04mm, .037 – .041in
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Method:
Reel, Carrier Tape
Packaging Quantity:
50000
Wire/Cable Type:
Discrete Wire
Product Type:
Contact
Connector & Contact Terminates To:
Printed Circuit Board
Profile:
Zero
Sealable:
No
Sleeve Style:
Bullet Nose
Connector System:
Cable-to-Board
Insertion Method:
Hand/Semi-Automatic/Automatic
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Termination Method to Wire & Cable:
Solder
Operating Temperature Range:
-85 – 257°F, -65 – 125°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Pin-in-Paste capable to 260°C

Alternate Descriptions

Newark Electronics
SKT MS S4 BN SN-AU 50M
Avnet America
SKT MS S4 BN SN-AU 50M
Allied Electronics, Inc
SOLIS SP SPD22-16COM22-18MIL1112
Avnet Europe
SKT MS S4 BN SN-AU 50M
Avnet Asia
SKT MS S4 BN SN-AU 50M