5-5330808-4

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Series Information for 5-5330808-4 - TE Connectivity
  • Status: Active
  • Product Code: 3076
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

SOCKET,MIN-SPR W/H SN-AU SER-1

Specifications

Sleeve Plating Material:
Tin
Sleeve Material:
Copper
Sealant:
No
Contact Transmits (Typical):
Signal (Data)/Power
Contact Mating Area Plating Thickness:
30µin, 30µm
Contact Base Material:
Beryllium Copper
Socket Type:
Discrete
Contact Spring Plating Thickness:
30µin, .762µm
Contact Type:
Socket
Contact Spring Plating Material:
Gold
Contact Current Rating (Max):
3A
Hole Size (Recommended):
1.04mm, .041in
Mating Pin Diameter Range:
.25 – .33mm, .01 – .013in
PCB Thickness (Recommended):
.79 – 3.18mm, .031 – .125in
Wire Size:
.0404 – .081mm², 31 – 28AWG
Socket Length:
3.61mm, .142in
Circuit Application:
Signal
Spring Material:
Beryllium Copper
Packaging Method:
Bag, Loose Piece
Packaging Quantity:
2000
Connector System:
Cable-to-Board
Sleeve Style:
Open Bottom
Connector & Contact Terminates To:
Printed Circuit Board
Profile:
Zero
Sealable:
No
Wire/Cable Type:
Discrete Wire
Product Type:
Contact
Termination Method to Wire & Cable:
Solder
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Insertion Method:
Hand/Semi-Automatic
Operating Temperature Range:
-85 – 257°F, -65 – 125°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Pin-in-Paste capable to 260°C

Alternate Descriptions

Newark Electronics
SOCKET,MIN-SPR W/H SN-AU SER-1
Avnet America
Conn Discrete Socket SKT 1 POS Solder ST SMD Loose Piece
Avnet Europe
Conn Discrete Socket SKT 1 POS Solder ST SMD Loose Piece