3-50871-0

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Series Information for 3-50871-0 - TE Connectivity
  • Status: Active
  • Product Code: 3076
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

MSS,TL,ASY,SER5,CB,.042/.049

Specifications

Sleeve Plating Material:
Tin
Sleeve Material:
Copper
Sealant:
No
Socket Type:
Discrete
Contact Type:
Socket
Contact Transmits (Typical):
Signal (Data)/Power
Contact Current Rating (Max):
7.5A
Contact Spring Plating Thickness:
2.54µm, 30µin
Contact Mating Area Plating Thickness:
2.54µm
Contact Base Material:
Beryllium Copper
Contact Spring Plating Material:
Tin
Mating Pin Diameter Range:
1.07 – 1.24mm, .042 – .049in
PCB Thickness (Recommended):
.031 – .125in, .79 – 3.18mm
Hole Size (Recommended):
.101in, 2.56mm
Socket Length:
7.32mm, .288in
Wire Size:
18 – 17AWG, .823 – 1.04mm²
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Method:
Loose Piece, Bag
Packaging Quantity:
2000
Connector & Contact Terminates To:
Printed Circuit Board
Sealable:
No
Profile:
Zero
Sleeve Style:
Closed Bottom
Wire/Cable Type:
Discrete Wire
Connector System:
Cable-to-Board
Product Type:
Contact
Termination Method to Wire & Cable:
Solder
Insertion Method:
Hand/Semi-Automatic
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Operating Temperature Range:
-65 – 125°C, -85 – 257°F

Compatibility

  • RoHS Compliant
  • Lead free solder process: Pin-in-Paste capable to 245°C

Alternate Descriptions

Avnet America
Conn Discrete Socket
Avnet Europe
Conn Discrete Socket