3-331272-1

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Series Information for 3-331272-1 - TE Connectivity
  • Status: Active
  • Product Code: 3076
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

SOCKET,MIN-SPR W/KO SN-AU S-2

Specifications

Sleeve Plating Material:
Tin
Sleeve Material:
Copper
Sealant:
No
Contact Type:
Socket
Contact Base Material:
Beryllium Copper
Contact Spring Plating Thickness:
30µin, .762µm
Contact Mating Area Plating Thickness:
30µin, 30µm
Contact Spring Plating Material:
Gold
Contact Current Rating (Max):
5A
Socket Type:
Discrete
Contact Transmits (Typical):
Signal (Data)/Power
Wire Size:
25 – 24AWG, .162 – .205mm²
Hole Size (Recommended):
.052in, 1.32mm
Socket Length:
.138in, 3.51mm
PCB Thickness (Recommended):
.79 – 3.18mm, .031 – .125in
Mating Pin Diameter Range:
.018 – .021in, .46 – .53mm
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Quantity:
2000
Packaging Method:
Bag, Loose Piece
Wire/Cable Type:
Discrete Wire
Sealable:
No
Sleeve Style:
Knockout Bottom
Profile:
Zero
Product Type:
Contact
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Cable-to-Board
Termination Method to Wire & Cable:
Solder
Insertion Method:
Hand/Semi-Automatic
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Operating Temperature Range:
-85 – 257°F, -65 – 125°C

Compatibility

  • Lead free solder process: Pin-in-Paste capable to 260°C