2309413-2

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Series Information for 2309413-2 - TE Connectivity
  • Status: Active
  • Product Code: L540
  • Global Product Line: 053
  • GPL Description: Data and Devices

Description

DDR4 SODIMM 260P 9.2H STD

Specifications

Latch Material:
High Temperature Thermoplastic
Ejector Location:
Both Ends
Ejector Type:
Locking
Module Key Type:
Offset Left
Retention Post Location:
Both Ends
Retention Post Material:
Stainless Steel
Center Key:
Offset Left
Number of Keys:
1
Number of Rows:
2
Module Orientation:
Right Angle
Number of Positions:
260
Keying:
Standard
Contact Base Material:
Copper Alloy
Socket Style:
SO DIMM
Contact Mating Area Plating Thickness:
5µin, .127µm
PCB Contact Termination Area Plating Material:
Gold Flash
Contact Underplating Material:
Nickel
Contact Mating Area Plating Material:
Gold
Contact Current Rating (Max):
.5A
端子の下地めっきの材料:
Nickel
Socket Type:
Memory Card
Stack Height:
9.2mm, .362in
DRAM Voltage:
1.2V
Housing Material:
High Temperature Thermoplastic
Centerline (Pitch):
.0197in, .5mm
Housing Color:
Black
UL Flammability Rating:
UL 94V-0
PCB Mount Retention Type:
Solder Peg
PCB Mounting Style:
Surface Mount
PCB Mount Retention:
With
Connector Mounting Type:
Board Mount
Circuit Application:
Power
Packaging Method:
Tape & Reel
Packaging Quantity:
500
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Cable-to-Board
DRAM Type:
Small Outline (SO)
Row-to-Row Spacing:
8.2mm, .322in
Center Post:
Without
Profile:
High
Product Type:
Socket
Sealable:
No
SGRAM Voltage:
1.2V
Insertion Style:
Cam-In
Operating Temperature Range:
-67 – 185°F, -55 – 85°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Reflow solder capable to 260°C

Alternate Descriptions

Avnet America
SO DIMM Socket 260 Position Surface Mount T/R