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Details for 2309412-2 by TE Connectivity
Connectors > Card & Socket Connectors > Memory Sockets > SO DIMM Sockets
DDR4 SODIMM 260P 8.0H RVS
2309412-2 image

2309412-2 by TE Connectivity

DDR4 SODIMM 260P 8.0H RVS
Part Information
2309412-2 image
RoHS Compliant
ELV Compliant
Reflow solder capable to 260°C
Status: Active
Product Code: L540
Global Product Line: 053
GPL Description: Data and Devices
Specifications
Retention Post Location:
Both Ends
Ejector Type:
Locking
Ejector Location:
Both Ends
Retention Post Material:
Stainless Steel
Latch Material:
High Temperature Thermoplastic
Module Key Type:
Offset Right
Number of Positions:
260
Module Orientation:
Right Angle
Keying:
Reverse
Number of Keys:
1
Number of Rows:
2
Center Key:
Offset Right
端子の下地めっきの材料:
Nickel
Contact Mating Area Plating Thickness:
5µin, .127µm
Contact Underplating Material:
Nickel
Socket Type:
Memory Card
Contact Current Rating (Max):
.5A
Contact Mating Area Plating Material:
Gold
Contact Base Material:
Copper Alloy
PCB Contact Termination Area Plating Material:
Gold Flash
Socket Style:
SO DIMM
Stack Height:
8mm, .315in
DRAM Voltage:
1.2V
Centerline (Pitch):
.5mm, .0197in
Housing Material:
High Temperature Thermoplastic
Housing Color:
Black
UL Flammability Rating:
UL 94V-0
PCB Mount Retention:
With
PCB Mount Retention Type:
Solder Peg
Connector Mounting Type:
Board Mount
PCB Mounting Style:
Surface Mount
Circuit Application:
Power
Packaging Method:
Tape & Reel
Packaging Quantity:
500
Connector & Contact Terminates To:
Printed Circuit Board
Profile:
High
Row-to-Row Spacing:
.322in, 8.2mm
Sealable:
No
DRAM Type:
Small Outline (SO)
Center Post:
Without
Product Type:
Socket
Connector System:
Cable-to-Board
SGRAM Voltage:
1.2V
Insertion Style:
Cam-In
Operating Temperature Range:
-67 – 185°F, -55 – 85°C
Alternate Descriptions
SO DIMM Socket 260 Position Surface Mount T/R Avnet America
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