2309410-4

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Series Information for 2309410-4 - TE Connectivity
  • Status: Active
  • Product Code: L540
  • Global Product Line: 053
  • GPL Description: Data and Devices

Description

DDR4 SODIMM 260P 5.2H RVS

Specifications

Retention Post Material:
Copper Alloy
Ejector Location:
Both Ends
Retention Post Location:
Both Ends
Ejector Type:
Locking
Latch Material:
High Temperature Thermoplastic
Number of Rows:
2
Number of Positions:
200, 260
Module Orientation:
Right Angle
Number of Keys:
1
Center Key:
Offset Right
Keying:
Reverse
端子の下地めっきの材料:
Nickel
Contact Base Material:
Copper Alloy
Socket Style:
SO DIMM
Contact Mating Area Plating Thickness:
.381µm, 15µin
PCB Contact Termination Area Plating Material:
Gold Flash
Contact Underplating Material:
Nickel
Contact Mating Area Plating Material:
Gold
Contact Current Rating (Max):
.5A
Socket Type:
Memory Card
Stack Height:
5.2mm, .205in
DRAM Voltage:
1.2V
Housing Color:
Black
Centerline (Pitch):
.0197in, .5mm
Housing Material:
High Temperature Thermoplastic
UL Flammability Rating:
UL 94V-0
PCB Mount Retention:
With
PCB Mount Retention Type:
Solder Peg
Connector Mounting Type:
Board Mount
PCB Mounting Style:
Surface Mount
Circuit Application:
Power
Packaging Quantity:
800
Packaging Method:
Tape & Reel
Product Type:
Socket
Row-to-Row Spacing:
.322in, 8.2mm
Sealable:
No
Center Post:
Without
Connector & Contact Terminates To:
Printed Circuit Board
Profile:
Low
DRAM Type:
Small Outline (SO)
Connector System:
Cable-to-Board
SGRAM Voltage:
1.2V
Insertion Style:
Cam-In
Operating Temperature Range:
-55 – 85°C, -67 – 185°F

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Reflow solder capable to 260°C

Alternate Descriptions

Avnet America
SO DIMM Socket 260 Position Surface Mount T/R
Avnet Asia
SO DIMM Socket 260 Position Surface Mount T/R