2309410-3

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Series Information for 2309410-3 - TE Connectivity
  • Status: Active
  • Product Code: L540
  • Global Product Line: 053
  • GPL Description: Data and Devices

Description

DDR4 SODIMM 260P 5.2H RVS

Specifications

Latch Material:
High Temperature Thermoplastic
Retention Post Location:
Both Ends
Ejector Location:
Both Ends
Retention Post Material:
Copper Alloy
Ejector Type:
Locking
Center Key:
Offset Right
Number of Positions:
260, 200
Keying:
Reverse
Module Orientation:
Right Angle
Number of Keys:
1
Number of Rows:
2
Contact Base Material:
Copper Alloy
Contact Mating Area Plating Material:
Gold
Contact Mating Area Plating Thickness:
10µin, .254µm
端子の下地めっきの材料:
Nickel
Contact Current Rating (Max):
.5A
Socket Style:
SO DIMM
Contact Underplating Material:
Nickel
PCB Contact Termination Area Plating Material:
Gold Flash
Socket Type:
Memory Card
Stack Height:
.205in, 5.2mm
DRAM Voltage:
1.2V
Centerline (Pitch):
.0197in, .5mm
Housing Color:
Black
Housing Material:
High Temperature Thermoplastic
UL Flammability Rating:
UL 94V-0
PCB Mount Retention:
With
PCB Mounting Style:
Surface Mount
Connector Mounting Type:
Board Mount
PCB Mount Retention Type:
Solder Peg
Circuit Application:
Power
Packaging Quantity:
800
Packaging Method:
Tape & Reel
DRAM Type:
Small Outline (SO)
Sealable:
No
Row-to-Row Spacing:
.322in, 8.2mm
Connector System:
Cable-to-Board
Center Post:
Without
Product Type:
Socket
Connector & Contact Terminates To:
Printed Circuit Board
Profile:
Low
SGRAM Voltage:
1.2V
Insertion Style:
Cam-In
Operating Temperature Range:
-67 – 185°F, -55 – 85°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Reflow solder capable to 260°C

Alternate Descriptions

Avnet America
Conn DDR4 SO DIMM SKT 260 POS 0.5mm Solder RA SMD T/R
Avnet Europe
Conn DDR4 SO DIMM SKT 260 POS 0.5mm Solder RA SMD T/R