2309408-3

Connectors

> Card & Socket Connectors

> Memory Sockets

> SO DIMM Sockets

distributor space
Organise Price Comparison Results by
Distributor Statistics for 2309408-3
Total in Stock: -in-stock
Lowest MOQ: -
SELECT OPTIONS
Lowest price for your selection
-
in Stock
-
Average Price: - per unit
Stocking Distributors: -
Price Comparison for 2309408-3
Series Information for 2309408-3 - TE Connectivity
  • Status: Active
  • Product Code: L540
  • Global Product Line: 053
  • GPL Description: Data and Devices

Description

DDR4 SODIMM 260P 4.0H RVS

Specifications

Ejector Type:
Locking
Retention Post Location:
Both Ends
Ejector Location:
Both Ends
Latch Material:
High Temperature Thermoplastic
Module Orientation:
Right Angle
Number of Keys:
1
Number of Rows:
2
Center Key:
Offset Right
Keying:
Reverse
Number of Positions:
260
Socket Style:
SO DIMM
Contact Base Material:
Copper Alloy
PCB Contact Termination Area Plating Material:
Gold Flash
Contact Current Rating (Max):
.5A
Contact Mating Area Plating Material:
Gold
Contact Mating Area Plating Thickness:
.254µm, 10µin
Socket Type:
Memory Card
Stack Height:
.157in, 4mm
DRAM Voltage:
1.2V
Centerline (Pitch):
.5mm, .0197in
Housing Color:
Black
Housing Material:
High Temperature Thermoplastic
UL Flammability Rating:
UL 94V-0
PCB Mount Retention:
With
PCB Mounting Style:
Surface Mount
PCB Mount Retention Type:
Solder Peg
Connector Mounting Type:
Board Mount
Circuit Application:
Power
Packaging Quantity:
900
Packaging Method:
Tape & Reel
Sealable:
No
Center Post:
Without
Row-to-Row Spacing:
.322in, 8.2mm
Connector & Contact Terminates To:
Printed Circuit Board
Product Type:
Socket
Profile:
Low
DRAM Type:
Small Outline (SO)
Connector System:
Cable-to-Board
SGRAM Voltage:
1.2V
Insertion Style:
Cam-In
Operating Temperature Range:
-67 – 185°F, -55 – 85°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Reflow solder capable to 260°C

Alternate Descriptions

Avnet America
SO DIMM Socket 260 Position Surface Mount T/R