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Details for 2309407-4 by TE Connectivity
Connectors > Card & Socket Connectors > Memory Sockets > SO DIMM Sockets
DDR4 SODIMM 260P 4.0H STD
2309407-4 image

2309407-4 by TE Connectivity

DDR4 SODIMM 260P 4.0H STD
Part Information
2309407-4 image
RoHS Compliant
ELV Compliant
Reflow solder capable to 260°C
Status: Active
Product Code: L540
Global Product Line: 053
GPL Description: Data and Devices
Specifications
Retention Post Location:
Both Ends
Ejector Location:
Both Ends
Latch Material:
High Temperature Thermoplastic
Module Key Type:
Offset Left
Ejector Type:
Locking
Keying:
Standard
Center Key:
Offset Left
Number of Keys:
1
Number of Rows:
2
Module Orientation:
Right Angle
Number of Positions:
260
Socket Style:
SO DIMM
Contact Mating Area Plating Thickness:
.381µm, 15µin
Contact Base Material:
Copper Alloy
PCB Contact Termination Area Plating Material:
Gold Flash
Contact Mating Area Plating Material:
Gold
Contact Current Rating (Max):
.5A
Socket Type:
Memory Card
Stack Height:
.157in, 4mm
DRAM Voltage:
1.2V
Centerline (Pitch):
.5mm, .0197in
Housing Color:
Black
Housing Material:
High Temperature Thermoplastic
UL Flammability Rating:
UL 94V-0
PCB Mounting Style:
Surface Mount
PCB Mount Retention Type:
Solder Peg
PCB Mount Retention:
With
Connector Mounting Type:
Board Mount
Circuit Application:
Power
Packaging Quantity:
900
Packaging Method:
Tape & Reel
Center Post:
Without
Sealable:
No
Row-to-Row Spacing:
.322in, 8.2mm
Product Type:
Socket
Profile:
Low
DRAM Type:
Small Outline (SO)
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Cable-to-Board
SGRAM Voltage:
1.2V
Insertion Style:
Cam-In
Operating Temperature Range:
-55 – 85°C, -67 – 185°F
Alternate Descriptions
DDR4 SODIMM Socket 260 Contacts 0.5mm Pitch 4mm Standard Height Right Angle T/R Avnet America
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