2013311-3

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Series Information for 2013311-3 - TE Connectivity
  • Status: Active
  • Product Code: E374
  • Global Product Line: 053
  • GPL Description: Data and Devices

Description

SEMI-HARD TRAY DDR3 204P 9.2H RVS Au0.76

Specifications

Latch Plating Material:
Tin
Latch Material:
Stainless Steel
Ejector Location:
Both Ends
Module Key Type:
SGRAM
Ejector Type:
Locking
Center Key:
Offset Right
Number of Keys:
1
Number of Rows:
2
Number of Bays:
2
Number of Positions:
204
Module Orientation:
Right Angle
Keying:
Reverse
Contact Mating Area Plating Thickness:
30µin, .76µm
Socket Style:
SO DIMM
Contact Base Material:
Copper Alloy
PCB Contact Termination Area Plating Material:
Gold
Contact Mating Area Plating Material:
Gold
Contact Current Rating (Max):
.5A
Socket Type:
Memory Card
Stack Height:
.362in, 9.2mm
DRAM Voltage:
1.5V
Centerline (Pitch):
.6mm, .024in
Housing Material:
High Temperature Thermoplastic
Housing Color:
Black
UL Flammability Rating:
UL 94V-0
PCB Mount Retention Type:
Solder Peg
PCB Mounting Style:
Surface Mount
PCB Mount Retention:
With
Connector Mounting Type:
Board Mount
Circuit Application:
Power
Comment:
With floating peg.
Packaging Quantity:
20
Packaging Method:
Semi-Hard Tray Assembly
Row-to-Row Spacing:
.322in, 8.2mm
Product Type:
Socket
Profile:
Reverse
Sealable:
No
DRAM Type:
Double Data Rate (DDR) 3
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Cable-to-Board
SGRAM Voltage:
1.5V
Insertion Style:
Cam-In
Operating Temperature Range:
-67 – 185°F, -55 – 85°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Reflow solder capable to 260°C

Alternate Descriptions

Newark Electronics
SEMI-HARD TRAY DDR3 204P 9.2H RVS Au0.76
Avnet America
Conn DDR3 SO DIMM SKT 204 POS 0.6mm Solder RA SMD Tray
Avnet Europe
Conn DDR3 SO DIMM SKT 204 POS 0.6mm Solder RA SMD Tray