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Details for 2013310-3 by TE Connectivity
Connectors > Card & Socket Connectors > Memory Sockets > SO DIMM Sockets
SEMI-HARD TRAY DDR3 204P 9.2H STD Au0.76
2013310-3 image

2013310-3 by TE Connectivity

SEMI-HARD TRAY DDR3 204P 9.2H STD Au0.76
Part Information
2013310-3 image
RoHS Compliant
ELV Compliant
Reflow solder capable to 260°C
Status: Active
Product Code: E374
Global Product Line: 053
GPL Description: Data and Devices
Specifications
Latch Material:
Stainless Steel
Latch Plating Material:
Tin
Ejector Location:
Both Ends
Ejector Type:
Locking
Module Key Type:
SGRAM
Number of Rows:
2
Module Orientation:
Right Angle
Number of Keys:
1
Number of Positions:
204
Center Key:
Offset Left
Number of Bays:
2
Keying:
Standard
Contact Mating Area Plating Thickness:
.76µm, 30µin
Socket Style:
SO DIMM
Contact Base Material:
Copper Alloy
PCB Contact Termination Area Plating Material:
Gold
Contact Mating Area Plating Material:
Gold
Contact Current Rating (Max):
.5A
Socket Type:
Memory Card
Stack Height:
.362in, 9.2mm
DRAM Voltage:
1.5V
Centerline (Pitch):
.6mm, .024in
Housing Material:
High Temperature Thermoplastic
Housing Color:
Black
UL Flammability Rating:
UL 94V-0
PCB Mount Retention Type:
Solder Peg
PCB Mount Retention:
With
PCB Mounting Style:
Surface Mount
Connector Mounting Type:
Board Mount
Circuit Application:
Power
Comment:
With floating peg.
Packaging Quantity:
20
Packaging Method:
Semi-Hard Tray Assembly
Row-to-Row Spacing:
.322in, 8.2mm
Product Type:
Socket
DRAM Type:
Double Data Rate (DDR) 3
Profile:
Standard
Connector & Contact Terminates To:
Printed Circuit Board
Sealable:
No
Connector System:
Cable-to-Board
SGRAM Voltage:
1.5V
Insertion Style:
Cam-In
Operating Temperature Range:
-55 – 85°C, -67 – 185°F
Alternate Descriptions
SEMI-HARD TRAY DDR3 204P 9.2H STD Au0.76 Newark Electronics
Conn DDR SO DIMM SKT 204 POS 0.6mm Solder RA SMD Tray Avnet America