2-50871-2

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Series Information for 2-50871-2 - TE Connectivity
  • Status: Active
  • Product Code: 3076
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

SOCKET,MIN-SPR AU SER-5

Specifications

Sealant:
No
Sleeve Plating Material:
Gold Flash over Nickel
Sleeve Material:
Copper
Contact Mating Area Plating Thickness:
30µm, 30µin
Socket Type:
Discrete
Contact Base Material:
Beryllium Copper
Contact Spring Plating Thickness:
30µin, .762µm
Contact Spring Plating Material:
Gold
Contact Current Rating (Max):
7.5A
Contact Transmits (Typical):
Signal (Data)/Power
Contact Type:
Socket
Wire Size:
1.31 – 2.08mm², 16 – 14AWG
Hole Size (Recommended):
2.56mm, .101in
PCB Thickness (Recommended):
.031 – .125in, .79 – 3.18mm
Mating Pin Diameter Range:
1.42 – 1.65mm, .056 – .065in
Socket Length:
7.32mm, .288in
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Quantity:
2000
Packaging Method:
Bag, Loose Piece
Connector System:
Cable-to-Board
Sealable:
No
Connector & Contact Terminates To:
Printed Circuit Board
Sleeve Style:
Closed Bottom
Profile:
Zero
Wire/Cable Type:
Discrete Wire
Product Type:
Contact
Termination Method to Wire & Cable:
Solder
Insertion Method:
Hand/Semi-Automatic
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Operating Temperature Range:
-65 – 125°C, -85 – 257°F

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Pin-in-Paste capable to 260°C

Alternate Descriptions

Newark Electronics
SOCKET,MIN-SPR AU SER-5
Avnet America
Conn Discrete Socket SKT 1 POS Solder ST SMD Loose Piece
Avnet Europe
Conn Discrete Socket SKT 1 POS Solder ST SMD Loose Piece

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