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Details for 2-2129710-7 by TE Connectivity
Connectors > Card & Socket Connectors > IC Sockets > LGA Sockets
2-2129710-7
Buy Directly from TE Store (155 in stock) $31.7300
LEFT SIDE LGA3647-1 SOCKET-P1 FOR ODM
2-2129710-7 image

2-2129710-7 by TE Connectivity

LEFT SIDE LGA3647-1 SOCKET-P1 FOR ODM
Part Information
2-2129710-7 image
RoHS Compliant
ELV Compliant
Reflow solder capable to 260°C
Status: Active
Product Code: WA01
Global Product Line: 060
GPL Description: Data and Devices
Specifications
Plating Material:
Gold
Plating Thickness:
30µin
Frame Style:
C Shape
Number of Positions:
1824
Grid Spacing:
.9906 x .8585mm, .039 x .0338in
Contact Current Rating (Max):
.5A
Socket Type:
LGA 3647
Contact Base Material:
Copper Alloy
Contact Mating Area Plating Material:
Gold
Contact Mating Area Plating Thickness:
30
壳体颜色:
Black
Housing Material:
High Temperature Thermoplastic
Centerline (Pitch):
.039in, .8585mm, .9906mm, .0338in
UL Flammability Rating:
UL 94V-0
Connector Mounting Type:
Board Mount
Heat Sink Attachment:
Without
PCB Mounting Style:
Surface Mount Solder Ball
Circuit Application:
Signal
Comment:
Lead-Free Solderball
Packaging Method:
Tray
Tray Color:
Black
製品タイプ:
Socket
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Board-to-Board
Operating Temperature Range:
-25 – 100°C, -13 – 212°F
Alternate Descriptions
Conn LGA SKT 1824 POS Solder Ball ST SMD Tray Avnet America
LEFT SIDE LGA3647-1 SOCKET-P1 FOR ODM Allied Electronics & Automation
Conn LGA SKT 1824 POS Solder Ball ST SMD Tray Avnet Europe
LEFT SIDE LGA3647-1 SOCKET-P1 FOR ODM IC Socket Type: LGA 3647 Connector System: Board-to-Board Number of Positions: 1824 Contact Mating Area Plating Material: Gold Contact Mating Area Plating Material Thickness: 30 µin LGA 3647 Board-to-Board 1824 Gold | Part Number: 2-2129710-7 | Internal Number: 2-2129710-7 | TE Connectivity TE Store