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Details for 2-2013297-3 by TE Connectivity
Connectors > Card & Socket Connectors > Memory Sockets > SO DIMM Sockets
EMBOSS TAPE DDR3 204P 8H STD Au 0.76
2-2013297-3 image

2-2013297-3 by TE Connectivity

EMBOSS TAPE DDR3 204P 8H STD Au 0.76
Part Information
2-2013297-3 image
RoHS Compliant
ELV Compliant
Reflow solder capable to 260°C
Status: Active
Product Code: E374
Global Product Line: 053
GPL Description: Data and Devices
Specifications
Latch Material:
Stainless Steel
Latch Plating Material:
Tin
Ejector Location:
Both Ends
Ejector Type:
Locking
Module Key Type:
SGRAM
Number of Rows:
2
Number of Keys:
1
Module Orientation:
Right Angle
Number of Positions:
204
Number of Bays:
2
Center Key:
Offset Left
Keying:
Standard
Contact Mating Area Plating Thickness:
.76µm, 30µin
Contact Base Material:
Copper Alloy
Socket Style:
SO DIMM
PCB Contact Termination Area Plating Material:
Gold
Contact Mating Area Plating Material:
Gold
Contact Current Rating (Max):
.5A
Socket Type:
Memory Card
Stack Height:
.315in, 8mm
DRAM Voltage:
1.5V
Centerline (Pitch):
.6mm, .024in
Housing Material:
High Temperature Thermoplastic
Housing Color:
Black
UL Flammability Rating:
UL 94V-0
PCB Mount Retention Type:
Solder Peg
PCB Mounting Style:
Surface Mount
PCB Mount Retention:
With
Connector Mounting Type:
Board Mount
Circuit Application:
Power
Comment:
With floating peg.
Packaging Quantity:
150
Packaging Method:
Emboss on Reel
Profile:
Standard
Row-to-Row Spacing:
.322in, 8.2mm
Sealable:
No
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Cable-to-Board
Product Type:
Socket
DRAM Type:
Double Data Rate (DDR) 3
SGRAM Voltage:
1.5V
Insertion Style:
Cam-In
Operating Temperature Range:
-67 – 185°F, -55 – 85°C