106890-1

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> Modular Jacks & Plugs

> RJ45 Connectors

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Series Information for 106890-1 - TE Connectivity
  • Status: Active
  • Product Code: 0632
  • Global Product Line: 073
  • GPL Description: Data and Devices

Description

8P.TOOLL.M-JACK KIT

Specifications

Connector Profile:
Standard
Modular Jack Latch Orientation:
Standard - Latch Down
Number of Positions:
8
Keyed:
No
Port Matrix Configuration:
1 x 1
Connector Contact Density:
Standard
Number of Loaded Positions:
8
Wiring Pattern:
One-to-One
PCB Mount Orientation:
Right Angle
Port Configuration:
Single Port
Contact Current Rating (Max):
1.5A
Contact Mating Area Plating Material Thickness:
49.21µin, 1.25µm
Connector Product Type:
Connector Assembly
Contact Base Material:
Phosphor Bronze
Contact Mating Area Plating Material:
Gold
Connector Height:
.866in, 22mm
PCB Tail Length:
1.55mm, .061in
コネクタの高さ:
22mm
Housing Color:
Green
Mating Entry Location:
Side
Centerline (Pitch):
.04in, 1.02mm
Housing Material:
PBT GF
Performance Category:
Cat 3
UL Flammability Rating:
UL 94V-0
Connector Mounting Type:
Panel, Board Mount
Shielded:
No
Circuit Application:
Signal
Comment:
When the jack is empty, positions 1-2 and 7-8 are used to perform an electronic test to locate a fault in an electronic circuit. The cable mount modular jack is soldered to a PCB with two resistors., When a plug is inserted into the jack, the solder legs at Positions 1-2 and 7-8 are disconnected so the modular jack can function normally.
実装方法:
Loose Piece
Packaging Quantity:
100
Packaging Method:
Loose Piece
Modular Jack & Plug Interface Type:
RJ45
Modular Connector Style:
Jack
Connectors & Connector Components Type:
Connector
Connector & Contact Terminates To:
Printed Circuit Board
Wire Termination Style:
Toolless
Modular Jacks & Plugs Products:
RJ Type Jacks & Plugs
Grounding Options:
PCB Ground
Termination Method to Wire & Cable:
Insulation Displacement Crimp (IDC)
Operating Temperature Range:
-40 – 85°C, -40 – 185°F

Compatibility

  • Compatible Parts: 188729-1, 1820802-1
  • Lead free solder process: Not reviewed for solder process capability