1-50865-2

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Series Information for 1-50865-2 - TE Connectivity
  • Status: Active
  • Product Code: 3076
  • Global Product Line: 377
  • GPL Description: Data and Devices

Description

MSS, SER-4 OPEN BOTTOM, AU/AU

Specifications

Sleeve Material:
Copper
Sealant:
No
Sleeve Plating Material:
Gold
Contact Mating Area Plating Thickness:
30µin, 30µm
Contact Spring Plating Thickness:
30µin, .762µm
Contact Type:
Socket
Socket Type:
Discrete
Contact Spring Plating Material:
Gold
Contact Transmits (Typical):
Signal (Data)/Power
Contact Current Rating (Max):
7.5A
Contact Base Material:
Beryllium Copper
Socket Length:
.26in, 6.6mm
PCB Thickness (Recommended):
.031 – .125in, .79 – 3.18mm
Mating Pin Diameter Range:
.034 – .041in, .86 – 1.04mm
Hole Size (Recommended):
1.83mm, .072in
Wire Size:
20 – 18AWG, .518 – .823mm²
Circuit Application:
Power & Signal
Spring Material:
Beryllium Copper
Packaging Quantity:
2000
Packaging Method:
Bag, Loose Piece
Sleeve Style:
Open Bottom
Connector System:
Cable-to-Board
Product Type:
Contact
Connector & Contact Terminates To:
Printed Circuit Board
Profile:
Zero
Wire/Cable Type:
Discrete Wire
Sealable:
No
Termination Method to Wire & Cable:
Solder
Insertion Method:
Hand/Semi-Automatic
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Operating Temperature Range:
-65 – 125°C, -85 – 257°F

Compatibility

  • Lead free solder process: Not reviewed for solder process capability