1-1394918-2

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Series Information for 1-1394918-2 - TE Connectivity
  • Status: Active
  • Product Code: G566
  • Global Product Line: 394
  • GPL Description: Appliances

Description

DUOPLG5.0 BU-STE 2P

Specifications

Connector Profile:
Standard
Keying Between Cavity Locations:
R2.5 / PL-2-
PCB Mount Orientation:
Right Angle
Number of Rows:
1
Connector Contact Load Condition:
Fully Loaded
Number of Positions:
2
Card Entry Style:
Side
Number of Insulation Displacement Slots:
2
Contact Mating Area Plating Material:
Tin
Contact Mating Area Plating Material Thickness:
196.849 – 472.439µin, 3 – 6µm
Contact Type:
Socket
Contact Current Rating (Max):
6A
PCB Contact Termination Area Plating Material:
Tin
Contact Retention Within Housing:
With
Contact Base Material:
CuNiSi
Accepts Wire Insulation Diameter Range:
.087in, 2.2mm
Height:
7.3mm, .287in
PCB Thickness (Recommended):
1.5mm, .059in
Wire Size:
.35 – .5mm², 22 – 20AWG
Operating Voltage:
250V
UL Voltage Rating:
250VAC
Housing Color:
Gray
Housing Material:
PA 6.6
Centerline (Pitch):
5mm, .197in
Housing Entry Configuration:
Both Ends Open
Agency/Standard:
UL
UL Flammability Rating:
UL 94V-0
Mating Alignment Type:
Keyed
Mating Retention:
With
Connector Mounting Type:
Cable Mount (Free-Hanging)
Contact Retention Type Within Housing:
Locking Lance
Panel Mount Feature:
Without
PCB Mount Retention:
Without
Mating Alignment:
With
PCB Mount Alignment:
With
Circuit Application:
Power
Packaging Quantity:
3850
Packaging Method:
Tray
Wire/Cable Type:
Discrete Wire
Connector & Housing Type:
Receptacle
Connector & Contact Terminates To:
Printed Circuit Board
Connector System:
Wire-to-Board
Termination Method to Wire & Cable:
Insulation Displacement Crimp (IDC)
Operating Temperature Range:
-40 – 230°F, -40 – 110°C

Compatibility

  • RoHS Compliant
  • ELV Compliant
  • Lead free solder process: Not applicable for solder process capability

Alternate Descriptions

Newark Electronics
DUOPLG5.0 BU-STE 2P
Avnet America
DUOPLG5.0 BU-STE 2P
Avnet Europe
DUOPLG5.0 BU-STE 2P

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